2026년 2월 12일 · Unknown · financial · 출처 Yahoo Finance
This article first appeared on GuruFocus.
Samsung Electronics (SSNLF, Financials) said it has begun mass production and commercial shipments of its latest high-bandwidth memory chips, HBM4, as it expands capacity to meet rising artificial intelligence demand.
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The business claims that HBM4 can handle data at speeds of 11.7 gigabits per second, which is 22% faster than HBM3E, its predecessor. The processors can go as fast as 13 Gbps, which might help with data constraints in AI applications.
Samsung said it is aggressively growing HBM4 manufacturing capacity because it anticipates HBM sales to more than treble in 2026 compared to 2025.
The business is going to make HBM4 for Nvidia's next-generation AI accelerator system, Vera Rubin. SK hynix is also likely to make HBM4 for the platform.
Samsung indicated that when HBM4 is available for sale, testing of HBM4E would start in the second half of 2026. Customers should start getting personalized HBM samples that are made to their exact specifications in 2027.
After the news, Samsung's stock climbed by 6.4%. As competition heats up in the high-performance memory market, investors will keep an eye on how well the company can ramp up production and get customers to use its products.
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